Miniaturization of electronics leads to more complex 3D interconnects for which no scalable solution exists today. Impulse Printing™ enables ultra-fast printing of high resolution (< 10 μm) and high aspect ratio functional structures. First, highly viscous inks are filled into pre-defined grooves in a printing plate. The plate is then rapidly heated, ejecting the complete pattern onto a substrate in milliseconds.
Impulse Printing™ smaller structurs than 10 μm is especially interesting for the semiconductor and display industry. Since electronics are getting smaller, interconnect density is increasing and these industries need an affordable, high performance solution.
Printing such small structures highly precise alignment between the substrate and Impulse plate. Part of such a system was developed to demonstrate that our printing technology is capable of meeting overlay demands.
In order identify the first market and validate the business plan, business development activities are be conducted as part of the project.